8 In-house Designed Superconductive Composite Heat Pipes
8 Superconductive composite heat pipes utilize groove and powder wick structure with dual variable heat pipe thickness for maximum efficiency of heat transfer.
Performance Dual Tower
Redesigned dual tower maximizes performance and surface area with optimized fin density and thickness.
8 Heat Pipe Array
Optimized lay out consisting of 8 heat pipes to ensure the heat is transferred to all fin area for efficient dissipation.
Expanded Copper Base
Expanded surface area of nickel plated copper base provides seamless contact and complete coverage to target all heat zones. Base layer thickness minimized for faster heat conductivity as well as lower cooler height for improved case compatibility.
Dual Mobius Fans
Equipped with dual variable Mobius fans for exceptional silence without compromising performance.
Dual Staggered Fan Setup
Staggered 120mm and 135mm Mobius fans create ultimate Push-Pull setup for perfect airflow and air pressure to maximize heat dissipation.
Maximum RAM Clearance
120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.
All Black Stealth Design
Stealth Series aluminum top cover and all black hardware provides a premium and clean design.
Pre-Applied High Performance Thermal Paste
Allmänt
- Processorsocket
- AMD AM4, AMD AM5, Intel 1150, Intel 1151, Intel 1155, Intel 1156, Intel 1200, Intel 1700
- Fläktstorlek
- 120 mm
- LED-belysning
- Nej
- Typ av kylning
- Luft aktiv (fläkt)
- Ljudnivå
- 22,6 dB
Mått och vikt
- Bredd
- 150,6 mm
- Längd
- 162,2 mm
- Vikt
- 1 630 g
Förpackningsinfo
- Förpackningsstorlek
- 257 x 246 x 198 mm
- Förpackningsvikt
- 2,29 kg
Förpackningsinfo (4 st)
- Förpackningsstorlek
- 520 x 405 x 278 mm
- Förpackningsvikt
- 10,00 kg